PCB BGA Reballing Solder Flux Paste for Computer Phone BGA IC Chips Repair, Low temperature lead free, 501 Original

Features:Unique formula, perfect performance, easy to weld, bright and full solder, no need to weld, false welding and other welding and welding tools.Lead free metal BGA flux paste solder paste for BGA soldering station.Solder paste, easy to weld, easy to form.Specifications:Material: plastic + solder pasteSize: 38x28mm/1.5x1.1\"Application scope: mobile phone chip maintenance, computer and digital service industry, high-precision circuit board SMT welding, BGA welding process, etc.High performance.Storage conditions: cold storage at room temperature4 packages: Package A: 183 ℃ medium temperature lead-free Package B: 183 ℃ medium temperature lead-free Package C: 138 ℃ low temperature lead-free Package D: high temperature lead-free packageBe careful:Harmful if inhaled and swallowed.The risk of cumulative effects.Keep away from food, drinks and animal feed.Do not eat, drink or smoke while using.Avoid any skin contact with solder paste for a long time or repeatedly. If swallowed, seek medical attention immediately.Seal and cool container bore.Notes:1. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!2. Please allow slight measuring deviation due to manual measurement.1 X Reballing Solder Flux Paste