NC-559-ASM No-Clean Tacky Gel Solder Flux 10cc X2 microsoldering phone

Features: brand new high quality Made of high-quality materials for durability This NC-559-ASM solder paste is used for BGA/CSP balls semiconductor packaging repair. This product is a no-clean solder paste with very little residue and does not require washing. The residue is colorless and transparent in appearance. Excellent printing performance suitable for handprint and machine printing. Suitable for BGA balls semiconductor packaging repair. Computer motherboard north-south bridge communication graphics card etc. BGA is applicable. Just apply a little at a time. It is the best BGA and CSP repair helper on the market. When the bumps of the BGA chip are coated with flux paste and the PCB pads need to be coated. Good BGA flux paste and machine will greatly improve the success rate regardless of manual soldering. Product parameters: Model: NC-559-ASM Color: as pictured Capacity: 10CC Package Included: 1 * NC-559-ASM Solder Paste Note: 1.The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness. 2.Please allow slight manual measurement deviation for the data.