Multi-purpose BGA Reballing Stencil Kit for Phone 6 6P 6S 6SP 7 7P IC Chip CPU Solder Tin Plant Net 0.12mm Thickness

Multi-purpose BGA Reballing Stencil Kit for Phone 6 6P 6S 6SP 7 7P IC Chip CPU Solder Tin Plant Net 0.12mm Thickness
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sku: 4000280130198
$6.49
Shipping from: China
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