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MiJing Z20p BGA Reballing Stencil Fixture Holder For iPhone 13 MINI/13/13 Pro MAX Motherboard Middle Frame Planting Tin Platform
sku: 1005004093363088
$42.36
1,650.00 грн.
+6%
~
1,750.00 грн.
$42.36, $1.00 = 41.25 грн.
~
3,850.00 руб.
$42.36, $1.00 = 91.00 руб.
€ 39.30
-3%
~
€ 38.10
$42.36, € 1.00 = $1.11
Shipping from: China
the store does not ship to your country
Price history chart & currency exchange rate
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81%
$43.98
MiJing 18 IN 1 BGA Reballing Stencil for iPhone 14 13 12 11 Pro Max XS X Motherboard Middle Frame Planting Tin Platform
78%
$35.82
MiJing 14 IN 1 BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS X Motherboard Middle Frame Planting Tin Platform
-4%
67%
$41.78
MiJing 18 IN 1 BGA Reballing Platform for iPhone 14 13 12 11 XS X Motherboard Middle Layer Planting Tin Fixture With Stencil
-4%
66%
$41.78
MiJing 18 IN1 BGA Reballing Platform for iPhone 14 13 12 11 XS Max X Motherboard Middle Layer Tin Planting With Stencil
56%
$18.80
Mijing M21 Universal BGA Reballing Stencil Magnetic Base For Phone Motherboard Middle Frame CPU IC Chip Planting Tin Fixture
54%
$18.98
MIJING M21 Universal BGA Reballing Stencil Magnetic Base for Phone Motherboard Middle Frame CPU CHIP IC Planting Tin Fixture
53%
$18.80
Mijing M21 Universal BGA Reballing Stencil Magnetic Base For Phone Motherboard Middle Frame CPU IC Chip Planting Tin Fixture
48%
$36.84
MiJing Z20 Pro 18 IN 1 BGA Reballing Stencil Kit For iPhone X-14Pro Max Middle Layer Motherboard Planting Tin Soldering Platform
-10%
46%
$16.38
Mijing M21 Universal BGA Reballing Stencil Magnetic Base For iPhone CPU NAND CHIP IC Tin Planting Platform Fixed Fixture tools
43%
$36.92
MiJing Z20 Pro 18 IN 1 BGA Reballing Stencil Kit For iPhone X-14Pro Max Middle Layer Motherboard Planting Tin Soldering Platform
+2%
40%
$36.95
MiJing Z20 Pro 18 IN 1 BGA Reballing Stencil Kit For iPhone X-14Pro Max Middle Layer Motherboard Planting Tin Soldering Platform
37%
$24.97
Mijing Z21 Max Universal CPU BGA Reballing Stencil Platform For Phone A8-A16 Android Phone IC Chip Planting Tin Template Fixture
+1%
35%
$21.63
Mijing Z21 Max Universal CPU BGA Reballing Stencil Platform For Phone A8-A16 Android Phone IC Chip Planting Tin Template Fixture
32%
$25.60
Mijing Z21 MAX CPU BGA Reballing Stencil Platform For iPhone A8-A16 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template
+1%
26%
$20.15
Mijing M21 Universal BGA Reballing Stencil Magnetic Base for The Middle Layer BGA Tin Planting Phone Motherboard Repair
-1%
24%
$23.75
Mijing Z21Max Universal BGA Reballing Stencil Platform For Phone A8-A17 Android Phones Chip Planting Tin Template Fixture tools
21%
$19.20
Mijing M21 Universal BGA Reballing Stencil Magnetic Base For CPU NAND CHIP IC Tin Planting Platform Fixed Fixture
19%
$13.10
MIJING M21 Universal BGA Reballing Stencil Magnetic Base for Mobile Phone Middle Layer Soldering CPU NAND Tin Planting Fixture
17%
$18.65
Mijing M21 Universal BGA Reballing Stencil Magnetic Base For Phone CPU NAND CHIP IC Tin Planting Platform Fixed Fixture
10%
$24.99
Mijing Z21 Max CPU BGA Reballing Stencil Platform For iPhone A8-A16 Android IC Chip Chipest Planting Tin Template Fixture Repair
7%
$25.27
MIJING Z21 MAX Chip Tin Planting Station Precise Positioning For A8-A16 Hisilicon Qualcomm Snapdragon BGA CPU Reballing Stencil
4%
$40.00
Mijing M21 Universal BGA Reballing Stencil Magnetic Base For Phone Motherboard Middle Frame CPU IC Chip Planting Tin Fixture
-1%
2%
$17.90
Mijing Z21Max Universal BGA Reballing Stencil Platform For Phone A8-A17 Android Phones Chip Planting Tin Template Fixture Tools
1%
$16.04
MIJING Z21 MAX Chip Tin Planting Station Precise Positioning For A8-A16 BGA CPU Reballing Stencil for IPhone Android full set
+1%
1%
$41.06
MiJing Z20 Pro Motherboard Middle Layer Positioning Tin Planting Platform For IPX-15 Series CPU Chips BGA Reballing Stencil Kit
1%
$24.98
Mijing Z21 Max Universal CPU BGA Reballing Stencil Platform For iPhone A8-A16 Android IC Chip Chipest Planting Tin Template
1%
$37.33
Mijing HW5-13 BGA Reballing Stencil Soldering Net Kit for Huawei Motherboard Rework Planting Tin Template Plate Steel Mesh
+1%
1%
$26.55
Mijing Z21 MAX CPU BGA Reballing Stencil Platform for iPhone, A8-A16, Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Templat
1%
$24.53
Mijing Z21 MAX CPU BGA Reballing Stencil Platform for iPhone, A8-A16, Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Templat
+1%
1%
$26.42
MIJING M21 BGA Reballing Stencil Magnetic Base For Mobile Phone Middle Layer Soldering CPU Chip IC Tin Planting Fixture Tools
1%
$35.19
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1%
$9.88
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1%
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-1%
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+1%
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0.063, 4.74
7/.031,874 0=.002,940 1=.003,237/1 2=.004,645/1 3=.002,078/1 4=.002,212/1 5=.010,356/1 6=.000,679/1 7=.008,667/36
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