Medium Low Temperature Tin Paste for Phone NAND Flash CPU WIFI Chip IC Planted Tin BGA Repair Solder Paste

Medium Low Temperature Tin Paste for Phone NAND Flash CPU WIFI Chip IC Planted Tin BGA Repair Solder Paste
Eachine1
sku: 1365193
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$6.29
Shipping from: China
   Description
Features: Good moisture retention. High purity. Bright color. The tin point is rounded. Type: A: Medium Temperature B: Low Temperature Package Included: 1 x Medium Low Temperature Tin Paste Detail Pictures:
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