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Mechanic BGA Reballing Stencil for HUAWEI MSM8994 MSM8974 HI3650 HI3660 MSM8916 MSM8937 MSM8940 MSM8996 MSM8998 CPU RAM IC Chip
sku: 1005003131722612
$2.46
94.50 грн.
+8%
~
102.00 грн.
$2.46, $1.00 = 41.40 грн.
229.00 руб.
-6%
~
215.00 руб.
$2.46, $1.00 = 87.54 руб.
€ 2.30
-2%
~
€ 2.26
$2.46, € 1.00 = $1.09
Shipping from: China
the store does not ship to your country
Price history chart & currency exchange rate
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99%
$2.46
Mechanic BGA Reballing Stencil for HUAWEI MSM8994 MSM8974 HI3650 HI3660 MSM8916 MSM8937 MSM8940 MSM8996 MSM8998 CPU RAM IC Chip
77%
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Mechanic BGA Reballing Stencil for Huawei Series MSM8974 MSM8994 HI3650 HI3660 CPU RAM IC Chip Universal Steel Stencil Tin Net
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Mechanic BGA Reballing Stencil for Huawei Series MSM8974 MSM8994 HI3650 HI3660 CPU RAM IC Chip Universal Steel Stencil Tin Net
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Mechanic BGA Reballing Stencil for Huawei Series MSM8974 MSM8994 HI3650 HI3660 CPU RAM IC Chip Universal Steel Stencil Tin Net
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Mechanic BGA Reballing Stencil for Huawei Series MSM8974 MSM8994 HI3650 HI3660 CPU RAM IC Chip Universal Steel Stencil Tin Net
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Mechanic BGA Reballing Stencil for Huawei Series MSM8953 1AB MSM8937 MSM8940 MSM8916 BGA221 BGA138 CPU IC Chip Steel Stencil
48%
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45%
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Wylie WL-55 BGA Reballing Stencil Template For Huawei MSM8974 Hi3650 HI3660 MSM8994 CPU Chip IC Tin Plant Net Steel Mesh
42%
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Wylie WL-55 BGA Reballing Stencil Template For Huawei MSM8974 Hi3650 HI3660 MSM8994 CPU Chip IC Tin Plant Net Black Steel Mesh
39%
$2.80
Mechanic S24-85 BGA Reballing Stencil For MSM8996/MSM8976/MSM8992/MSM8953/MSM8937/MSM8998/MSM8916 CPU IC Chip Tin Net Steel Mesh
32%
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AMAOE BGA Reballing Stencil For MSM8956 8976 MSM8974 MSM8992 MSM8994 MSM8996 MSM8998 MT6595 MT6795W MT6797W CPU RAM IC Tin Net
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AMAOE BGA Reballing Stencil For MSM8956 8976 MSM8974 MSM8992 MSM8994 MSM8996 MSM8998 MT6595 MT6795W MT6797W CPU RAM IC Tin Net
27%
$3.94
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Amaoe High quality For MSM8996 MSM8976 MSM8992 MSM8953 MSM8937 SDM660 MSM8998 MSM8952 MSM8974 MSM8994 CPU RAM BGA Reball Stencil
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1%
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Upper layer CPU BGA Reballing Stencil Steel mesh For Android MSM8996 MSM8994 MSM8998 HI3660 Heating Reball Tin Net Template
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For Qualcomm CPU MSM8996 MSM8976 MSM8992 MSM8953 MSM8937 MSM8998 MSM8916 BGA Reballing Stencil Heating Reball Tin Net Template
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0.032, 10.76
7/.013,274 0=.000,080 1=.000,706/1 2=.000,629/1 3=.000,388/1 4=.000,846/1 5=.004,786/1 6=.000,095/1 7=.005,824/36
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