MJ Groove 3D Mainboard BGA Reballing Stencil Planting Tin Steel Mesh For iPhone A12 XS MAX XR Motherboard Rework Soldering Tool
Technical Details
| Advantage: | New Patented 3D Tin Plant Steel Net |
| Application: | for phone repairing |
| Brand Name: | DIYPHONE |
| Compacity: | for iPhone A12 XS MAX XR, MJ 3D A12 |
| Condition: | Full New |
| design: | Stepped Groove |
| Difference: | Thicker than Ordinary Stencils in the Market |
| DIY Supplies: | Electrical |
| diy type: | CPU BGA Reballing |
| Drop Shipping: | Support |
| Features: | Square Holes Design, Easier to Take Out the Formed Solder Balls |
| Function: | BGA Rework, CPU Soldering Repair Tools |
| item name: | New 3D BGA Rework Stencils Template |
| Material: | High-end Imported Steel Mesh |
| Model Number: | MJ Groove 3D BGA Reballing Stencil |
| Package: | Box |
| Packing: | Bag |
| Period of Dispatch: | Within 3 Days |
| Size: | 84mm*68mm |
| Supplier: | DIYPHONE |
| Type: | Phone repair tools |
| Usage: | for iPhone Motherboard, NAND Flash, Touch IC, Baseband Rework |
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