MJ Groove 3D Mainboard BGA Reballing Stencil Planting Tin Steel Mesh For iPhone A12 XS MAX XR Motherboard Rework Soldering Tool
Technical Details
Advantage: | New Patented 3D Tin Plant Steel Net |
Application: | for phone repairing |
Brand Name: | DIYPHONE |
Compacity: | for iPhone A12 XS MAX XR, MJ 3D A12 |
Condition: | Full New |
design: | Stepped Groove |
Difference: | Thicker than Ordinary Stencils in the Market |
DIY Supplies: | Electrical |
diy type: | CPU BGA Reballing |
Drop Shipping: | Support |
Features: | Square Holes Design, Easier to Take Out the Formed Solder Balls |
Function: | BGA Rework, CPU Soldering Repair Tools |
item name: | New 3D BGA Rework Stencils Template |
Material: | High-end Imported Steel Mesh |
Model Number: | MJ Groove 3D BGA Reballing Stencil |
Package: | Box |
Packing: | Bag |
Period of Dispatch: | Within 3 Days |
Size: | 84mm*68mm |
Supplier: | DIYPHONE |
Type: | Phone repair tools |
Usage: | for iPhone Motherboard, NAND Flash, Touch IC, Baseband Rework |
Price history chart & currency exchange rate