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Tool Sets
MIJING Z21 MAX Chip Tin Planting Table For iPhone 6-15promax Huawei Qualcomm Snapdragon Hisilicon BGA CPU Reballing Stencils
артикул: 1005004837305180
$16.25
665.00 грн.
+3%
~
685.00 грн.
$16.25, $1.00 = 42.25 грн.
1,520.00 руб.
+20%
~
1,830.00 руб.
$16.25, $1.00 = 112.53 руб.
€ 15.10
+5%
~
€ 15.80
$16.25, € 1.00 = $1.03
Доставка из: Китай
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Mijing Z21 Max A8~A17 CPU Chip Tin Planting Platform For iPhone 6-15 Pro MAX Hisilicon Qualcomm Snapdragon BGA Reballing Stencil
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Mijing Z21 MAX CPU BGA Reballing Stencil Platform For iPhone A8-A17 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template
71%
$25.60
Mijing Z21 MAX CPU BGA Reballing Stencil Platform For iPhone A8-A16 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template
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$25.99
Mijing Z21 MAX Chip Tin Planting Table FOR IPHONE A8-A16 Hisilicon Qualcomm Snapdragon BGA CPU Reballing Stencil
64%
$25.77
Mijing Z21 MAX CPU BGA Reballing Stencil Platform For iPhone A8-A16 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template
61%
$22.73
MIJING MJ Z21 MAX чип оловянный стол для посадки для iPhone 6-15promax Huawei Qualcomm Snapdragon Hisilicon BGA CPU реболлинговые трафареты
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Mijing Z21 MAX CPU Chip Tin Planting Station For iPhone A8-A16 Hisilicon Qualcomm BGA CPU Reballing Stencil Soldering Kits
55%
$25.27
MIJING Z21 MAX Chip Tin Planting Station Precise Positioning For A8-A16 Hisilicon Qualcomm Snapdragon BGA CPU Reballing Stencil
53%
$25.36
MIJING Z21 MAX Chip Tin Planting Station Precise Positioning For A8-A16 Hisilicon Qualcomm Snapdragon BGA CPU Reballing Stencil
50%
$25.75
MIJING Z21 MAX Chip Tin Planting Station Precise Positioning For A8-A16 Hisilicon Qualcomm Snapdragon BGA CPU Reballing Stencil
44%
$29.80
MIJING Z21 MAX Chip Tin Station Precise Positioning FOR IPHONE A8-A16 CPU Qualcomm Snapdragon Hisilicon EMMC Reballing Stencil
40%
$20.23
MIJING Z21 MAX Chip Tin Station Precise Positioning FOR IPHONE A8-A16 CPU Qualcomm Snapdragon Hisilicon EMMC Reballing Stencil
37%
$25.77
MIJING Z21 MAX Chip Tin Planting Station Precise Positioning For A8-A16 Hisilicon Qualcomm Snapdragon BGA CPU Reballing Stencil
36%
$33.72
MIJING Z21 MAX Chip Tin Station Precise Positioning FOR IPHONE A8-A16 CPU Qualcomm Snapdragon Hisilicon EMMC Reballing Stencil
34%
$20.58
MIJING Z21 MAX Chip Tin Station Precise Positioning FOR IPHONE A8-A16 CPU Qualcomm Snapdragon Hisilicon EMMC Reballing Stencil
33%
$33.72
Mijing Z21 Max Chip Tin Station Precise Positioning For Iphone A8-a16 Cpu Qualcomm Snapdragon Hisilicon Emmc Reballing Stencil
31%
$25.16
MIJING Z21 MAX Chip Tin Station Precise Positioning FOR IPHONE A8-A16 CPU Qualcomm Snapdragon Hisilicon EMMC Reballing Stencil
24%
$24.53
Mijing Z21 MAX CPU BGA Reballing Stencil Platform for iPhone, A8-A16, Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Templat
21%
$26.55
Mijing Z21 MAX CPU BGA Reballing Stencil Platform for iPhone, A8-A16, Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Templat
19%
$25.99
MIJING Z21 MAX Chip Tin Station Precise Positioning FOR IPHONE A8-A16 CPU Qualcomm Snapdragon Hisilicon EMMC Reballing Stencil
16%
$21.33
MIJING Z21 MAX Chip Tin Station Precise Positioning FOR IPHONE A8-A16 CPU Qualcomm Snapdragon Hisilicon EMMC Reballing Stencil
14%
$24.57
Mijing Z21 MAX CPU BGA Reballing Stencil Platform For iPhone A8-A16 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template
12%
$23.01
MIJING Z21 MAX Chip Tin Station Precise Positioning FOR IPHONE A8-A16 CPU Qualcomm Snapdragon Hisilicon EMMC Reballing Stencil
+3%
11%
$17.28
SFDER Z21 MAX CPU BGA Reballing Stencil Platform For IPhone A8-A16 Android Qualcomm Snapdragon IC Chip Planting Tin Template
8%
$25.99
MIJING Z21 MAX Chip Tin Station Precise Positioning FOR IPHONE A8-A16 CPU Qualcomm Snapdragon Hisilicon EMMC Reballing Stencil
5%
$23.01
MIJING Z21 MAX Chip Tin Station Precise Positioning FOR IPHONE A8-A16 CPU Qualcomm Snapdragon Hisilicon EMMC Reballing Stencil
1%
$29.99
MIJING Android CPU IPHONE A8-A16 Hisilicon Qualcomm Snapdragon Tin Planting Platform BGA CPU Reballing Stencil
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$22.50
Mijing Z21 MAX CPU BGA Reballing Stencil Platform For iPhone A8-A16 Qualcomm Phone IC Chip Planting Tin Template Fixture Tools
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$48.26
RELIFE RL-044 58PCS BGA Reballing Stencil Set for Qualcomm |Snapdragon Dimensity Hisilicon Kirin Exynos Chip Planting Tin Net
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Mijing Z21 MAX CPU BGA Reballing Stencil Platform For iPhone A8-A16 For Hisilicon For Qualcomm For Snapdragon IC Chip Fixture
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О нас
Контакты
0.041, 11.36
6/.014,442 0=.000,089 1=.000,782/1 2=.000,711/1 3=.000,533/1 4=.005,137/1 5=.000,110/1 6=.007,169/36
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