MG Chemicals 4900P-25G Lead Free No Clean Solder Paste

MG Chemicals 4900P-25G Lead Free No Clean Solder Paste The MG Chemicals 4900P-25G lead free no clean solder paste has developed a unique flux system designed specifically for high temperature lead free alloys. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required MG 4900P Lead Free Solder paste will provide excellent cost savings. In addition MG 4900P Lead Free solder paste exhibits superior joint strength excellent wettability and extraordinary print definition and tack life. The post soldering residues of MG 4900P are non-conductive non-corrosive and highly insulated.