MECHANIC iCPU 8in1 BGA Reballing Platform For iPhone A8 A9 A10 A11 A12 A13 A14 A15 Mainboard CPU IC Chip Glue Removal Layering

MECHANIC iCPU 8in1 BGA Reballing Platform For iPhone A8 A9 A10 A11 A12 A13 A14 A15 Mainboard CPU IC Chip Glue Removal Layering
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sku: 1005002532540359
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$39.86
Shipping from: China
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