MECHANIC Soldering Paste Flux XG-50 XG-Z40 Solder Tin Sn63/Pb67 for Soldering Iron Circuit Board SMT SMD Repair Tool Paste Flux
Technical Details
| Alloy: | Sn63/Pb37 |
| Application: | Applicable to Phone PCB, BGA, SMD, PGA Repair |
| Brand Name: | NoEnName_Null |
| design: | Needle Tube |
| diy type: | Computer, Phone Chip Reballing |
| Drop ship: | Support |
| Features: | High Viscosity No-clean Flux |
| Function: | Repair the Circuit Boards, Protect The Electronic Components |
| is-customized: | No |
| item name: | BGA Soldering Tin Cream |
| Material: | Tin+Solder Paste |
| Microns: | 25-38um |
| Model: | Dispenser Needle Solder |
| Model Number: | XG-Z40 / XG-50 |
| Particle Size: | 25-48μm |
| Product: | XG-Z40 / XG-50 |
| quantity: | One/Lots |
| Size: | Approx 1.30*1.30*1.14inch / 3.3*3.2*2.9cm |
| Suitable for: | Phone, Computer Repair Industry |
| Temperature: | 183 |
| Type: | BGA Soldering Paste |
| Usage: | PCB BGA Repairing Tool |
| Volume: | 10ml |
| With Squeeze Tube: | Yes |
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