LY R890A Automatic align BGA soldering station with CCD alignment system and HD touch screen 220V
Technical Details
BGA chip size: | Max.80x80mm Min.1x1mm |
Dimension: | L600x W640x H850mm |
Heating: | Infrared heating, hot air heating |
is customized: | No |
Model Number: | LY R890A Hot air infrared BGA Rework Station |
PCB size: | Max430x400mm, Min50x50mm |
Rated Voltage: | 220V AC |
Zones: | 3 |
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