LY G700 Hot Air BGA Rework Solder Station Mobile Phone Chip Reballing Repairing Machine

LY G700 Hot Air BGA Rework Solder Station Mobile Phone Chip Reballing Repairing Machine
sku: 32901511235
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$2,463.90
Shipping from: China
   Technical Details
Applicable chips: Max 80*80mm Min 1*1 mm
Brand Name: LY
Heater power: Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W
is customized: No
Model Number: LY G700
Overall Dimension: L650*W630*H850mm
PCB size: Max 450*390mm Min 10*10 mm
Power Supply: AC 220V +-10% 50/60Hz
Total Power: Max 5300W
   Price history chart & currency exchange rate

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