LY G700 Align BGA Rework Station Hot Air BGA Reballing Machine for Mobile phone chips Main board Repairing

LY G700 Align BGA Rework Station Hot Air BGA Reballing Machine for Mobile phone chips Main board Repairing
sku: 32847707374
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$2,957.32
Shipping from: China
   Technical Details
Brand Name: LY
is customized: Yes
Model Number: LY G700
PCB size: Max 450*390mm Min 10*10 mm
Power Supply: AC 220V+-10% 50/60Hz
Total Power: Max 5300W
Weight of machine: 60KG
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