Kaisi 303pro Motherboard Layering Rapid Separation For iPhone X XS XSMAX 11 11Pro Max Heating Disassembly Platform

For iPhone IX IXS IXSMAX CPU ​1 Separation process by setting separation temperature parameters through thermostat operation Firstly the layered motherboard alignment pin holes will be installed on the separator heating board Then push the button back and tighten the motherboard Setting separation temperature recommended 200 220 Degrees Setting the time required for separation process about 10 seconds recommended The thermostat feedbacks the actual temperature value of the current heating plate in real time Then press the start button The heating pipe is heating the heating plate 2 Heating temperature reaches the set temperature value The control board sends out three beeps to di di di Stop heating and automatically maintain heating temperature control When the countdown time arrives the control panel emits a di buzz and stops heating at the same time and starts the cooling fan to heat the heating board forcibly After the temperature of the heating plate drops by 55 the control panel emits di for 3 seconds The layering machine enters a low power standby sleep state 3 At this time you need to start the machine again You can start the layering work again by pressing the start button after replacing the motherboard to be layered The machine uses the last set parameter to run by default If you need to modify the parameters you can modify the required parameters and then press the start button After the machine is used it is recommended to turn off the ma