Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering Net

Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 8 8P Motherboard IC Chip Ball Soldering Net
Eachine1
sku: 1235970
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$5.06
Shipping from: China
   Description
Features: Efficient: quick alignment for operating of reballing Easy: positioning pins for precise alignment Durable: Long Time Operating and Usage Lifetime Application Model: iphone 8 Plus, 8 Function: Repairing or fixing problem of iphone 6s Plus 6s processor Package includes: 1 x BGA Reballing Stencils for iPhone 8/8P Details pictures:
   Price history chart & currency exchange rate

Customers also viewed