Japan Steel Phone Logic Board BGA Repair Stencil Tool for iPhone 7 7P Motherboard IC Chip Ball Soldering Net

Japan Steel Phone Logic Board BGA Repair Stencil Tool for iPhone 7 7P Motherboard IC Chip Ball Soldering Net
Eachine1
sku: 1235982
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$5.01
Shipping from: China
   Description
Features: Efficient: quick alignment for operating of reballing Easy: positioning pins for precise alignment Durable: Long Time Operating and Usage Lifetime Application Model: iphone 7, 7P. Function: Repairing or fixing problem of iphone 7 7P processor. Package includes: 1 x BGA Reballing Stencils for iPhone 7/7P Details pictures:
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