Japan Stainless Steel BGA Stencil for Samsung S8/S8+/NOTE8/MSM8998/CPU/G9500/G955U/N9500 BGA Reballing Plate Solder Template

Japan Stainless Steel BGA Stencil for Samsung S8/S8+/NOTE8/MSM8998/CPU/G9500/G955U/N9500 BGA Reballing Plate Solder Template
thumb
thumb
thumb
sku: 33027205405
$4.50
Shipping from: China
   Technical Details
Application: BGA Stencil for Samsung S8/S8+/NOTE8/MSM8998/CPU/G9500/G955U/N9500
Material: Stainless Steel
Model Number: BGA Stencil
Thickness: 0.12mm Thickness
   Price history chart & currency exchange rate

Customers also viewed