JEYI Soft 18Pcs NVME NGFF M.2 2280 Silicon Thermal Conductivity Heat Dissipation Sheet Wafer Cooling

Specification: 1. Brand: JEYI 2. Name: JEYI Phase Change Thermal Silicon Small Block (Referred to as "Small Block Thermal Conductivity") 3. Model: Thermal Conductivity Small Block 4. Small Block Size: 10.5mm x 10.5mm x 0.6mm Features: 1. High thermal conductivity, good thermal conductivity 2. Using phase change thermal techniques, the better the heat conductive properties. 3. Slim 0.6mm design, can be used in two or more pieces. 4. Good flexibility, service posted strong, can be repeatedly used. 5. Support equipment, a variety of solid-state disk master, chip thermal conductivity. Note: This Product is only for Thermal Silicon, Need to be used with the Heat Sink. (Data from the JEYI Laboratory Manual Measurement or a Slight Error) Package Included: 1x18Pcs Small Block Tips: This Product is Only Thermally Conductive Silicon Wafer, Not including the Heat Sink; This product must be used in conjunction with the heat sink to achieve the cooling effect.