Inteligent Soldering Station MECHANIC T360 Fast Heat Up for SOIC CHIP QFP PLCC BGA Desoldering Repair Tool T210 T245 Replace

Inteligent Soldering Station MECHANIC T360 Fast Heat Up for SOIC CHIP QFP PLCC BGA Desoldering Repair Tool T210 T245 Replace
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sku: 1005006990641947
$100.00+28%
$127.82
Shipping from: China
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