Halnziye paper box package nano thermal paste compound HY880 30g for CPU&GPU

Halnziye paper box package nano thermal paste compound HY880 30g for CPU&GPU
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sku: 32281516762
$17.00
Shipping from: China
   Technical Details
Air Volume: 30CFM
Application: Processor
Bearing: Fluid Bearing
Bleed: <0.05
Brand Name: HALNZIYE
Certificate: RoHS,CE,SVHC
Color: Grey
Compatible CPU: Intel&AMD
Dielectric Constant: >5.1
Fan Size: no
Fan Speed Control: No RPM
Heatsink Material: Copper & Aluminum
Lines: None
Model: HY880
Model Number: HY880
Noise: no
Operation Temperture: -30~280 degree C
Package: Yes
Power: 2.5W
Specific Gravity: >3.25g/cm3
Thermal Conductivity: >5.15W/m-K
Thermal Impedance: <0.0087
Type: Conductive Heatsink Plaster
   Price history chart & currency exchange rate

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