G-Lon Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone X Motherboard Repair with Solder Paste Suit

G-Lon Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone X Motherboard Repair with Solder Paste Suit
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sku: 4000033613327
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$7.88
Shipping from: China
   Technical Details
Application: For iPhone Logic Board Repairing
Features: Motherboard Repair Planting Tin Fixture for iPhone
Function: Logic Board Repair Planting Tin Fixture for iPhone
is customized: No
item name: IPhone X Middle Board BGA Reballing Stencil with Solder Paste
Model Number: Logic Board Repairing for iPhone X
Size: 15.5*8*3.5cm
Type: Phone Repairing Tools
Usage: Phone Logic Board Repair Fixture
Weight: 0.4kg
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