For Samsung S6 S6+ Note5 S8 S8+ Note8 S9 S9+ S7 Series BGA Reballing Stencil Kit CPU Chip Heating Reballing Heating Template

For Samsung S6 S6+ Note5 S8 S8+ Note8 S9 S9+ S7 Series BGA Reballing Stencil Kit CPU Chip Heating Reballing Heating Template
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sku: 33000762368
$4.90
Shipping from: China
   Technical Details
Application: S9 S9+
Feature: Anti Drum-up
Model Number: 0899
Particle Size: 5-15μm
   Price history chart & currency exchange rate

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