For Samsung S6 S6+ Note5 S8 S8+ Note8 S9 S9+ S7 Series BGA Reballing Stencil Kit CPU Chip Heating Reballing Heating Template
sku: 33000762368
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$9.10
Shipping from: China
Technical Details
| Application: | S9 S9+ |
| Feature: | Anti Drum-up |
| Model Number: | 0899 |
| Particle Size: | 5-15μm |
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