For MTK PM660 670 845 MT6358W 6356W 6355W Power IC BGA Reballing Stencil Kit 0.12mm Thickness Tin Mesh Solder Template

For MTK PM660 670 845 MT6358W 6356W 6355W Power IC BGA Reballing Stencil Kit 0.12mm Thickness Tin Mesh Solder Template
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sku: 33045814608
$5.99
Shipping from: China
   Technical Details
Application: BGA rework station accessory
Function: Reballing Assistant
Model Number: MTK BGA Reballing Stencil
Particle Size: 1-10μm
Thickness: 0.12mm
Type: Reballing stencil
   Price history chart & currency exchange rate

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