For Iphone x Middle Layer of BGA motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp

For Iphone x Middle Layer of BGA motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp
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sku: 32958533035
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$5.80
Shipping from: China
   Technical Details
Application: For iphoneX Special solder paste
Model Number: SP-X
Particle Size: 1-10μm
Type: ipx Solder Paste
Weight: 50g
   Price history chart & currency exchange rate

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