For Huawei CPU RAM IC BGA Stencil HI6260/3670/3680 Reballing Chip Tin Plant Net Solder Heat Template Amaoe 0.12mm Thickness HU:3

For Huawei CPU RAM IC BGA Stencil HI6260/3670/3680 Reballing Chip Tin Plant Net Solder Heat Template Amaoe 0.12mm Thickness HU:3
sku: 4000040880010
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$3.80
Shipping from: China
   Technical Details
Application: Mobile Phone
Brand Name: ICO IVYCASSIE
Condition: New
Dissipation Power: 0.5W
is customized: Yes
Model Number: HU3
Operating Temperature: 0-300
Place of Origin: Guangdong China (Mainland)
Supply Voltage: 1.5-5V
Type: Logic ICs
   Price history chart & currency exchange rate

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