For Huawei CPU RAM BGA Stencil MSM8974 HI3650 HI3660 MSM8994 Reballing IC Pins Heat Template Thickening Tin Plant Steel WL-55

For Huawei CPU RAM BGA Stencil MSM8974 HI3650 HI3660 MSM8994 Reballing IC Pins Heat Template Thickening Tin Plant Steel WL-55
артикул: 32908951010
СОГЛАСНО НАШИМ ДАННЫМ, ЭТОТ ПРОДУКТ СЕЙЧАС НЕ ДОСТУПЕН
$7.04
Доставка из: Китай
   График изменения цены & курс обмена валют

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