Bga Reballing Stencil Kit for iPhone XS/XS MAX/X Logic Board Middle Layer Hard Disk Planting Tin Template Reballing Plate
Характеристики
Function: | BGA Stencil for iPhone XS/XS MAX Motherboard Middle Layer Hard Disk |
Material: | Stainless Steel |
Model Number: | BGA Stencil |
Particle Size: | 1-10μm |
Thickness: | 0.15mm |
Usage: | BGA Stencil for iPhone X Motherboard Middle Layer Hard Disk |
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