BRNEACI 3D BGA Reballing Stencil for iPhone X Solder Template Tin Platform Motherboard IC Chip Rework Tool

BRNEACI 3D BGA Reballing Stencil for iPhone X Solder Template Tin Platform Motherboard IC Chip Rework Tool
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sku: 4000162375271
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$15.00
Shipping from: China
   Technical Details
Application: Computer Tool Kit
Brand Name: brneaci
DIY Supplies: Electrical
Feature: square precise hole position
Function: Used to repair motherboard IC chip
Model Number: 3D BGA Stencil
Package: Case
Particle Size: 0.10~0.15mm
Size: 50*50*2MM
Type: Combination
Usage: Repair Tools For iPhone X/XS/MAX
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