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BGA Tin Solder Paste No-clean Syringe Liquid Flux Melting Point 183 degrees Applicable to Phone PCB BGA SMD PGA Repair 55/35g
sku: 1005003507750117
$12.74
515.00 грн.
+2%
~
525.00 грн.
$12.74, $1.00 = 41.20 грн.
1,140.00 руб.
+4%
~
1,190.00 руб.
$12.74, $1.00 = 93.41 руб.
€ 11.70
-2%
~
€ 11.50
$12.74, € 1.00 = $1.11
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