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BGA Stencil For SM7325 7315 Qualcomm Snapdragon 778G CPU Stencil Replanting tin seed beads BGA Stencil
sku: 1005005881867161
$3.92
+2%
$4.00
163.00 грн.
+1%
~
165.00 грн.
$4.00, $1.00 = 41.25 грн.
378.00 руб.
-7%
~
351.00 руб.
$4.00, $1.00 = 87.81 руб.
€ 3.66
+1%
~
€ 3.70
$4.00, € 1.00 = $1.09
Shipping from: China
the store does not ship to your country
Price history chart & currency exchange rate
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$3.76
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44%
$5.08
Amaoe HW16 BGA Reballing Stencil For Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU Planting Tin Net Repair Tools
-3%
41%
$2.34
Amaoe HW16 BGA Reballing Stencil For Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU Planting Tin Net Repair Tools
39%
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32%
$4.30
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29%
$4.41
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27%
$4.98
Amaoe HW16 BGA Reballing Stencil for Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU IC Chip Tin Planting Tool 0.12MM
24%
$4.33
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23%
$4.41
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22%
$3.97
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19%
$4.40
Amaoe HW 16 BGA Reballing Stencil For Huawei Glory 50/50pro Qualcomm Snapdragon 778G/SM7325 Tin Planting Net Steel Mesh
16%
$4.50
Amaoe HW16 BGA Reballing Stencil for Huawei Glory 50/50pro Qualcomm Snapdragon 778G/SM7325 Tin Planting Net Steel Mesh
14%
$4.99
Amaoe HW:16 BGA Reballing Stencil For Steel Mesh Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU SDR735
12%
$4.50
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11%
$3.98
HW16 CPU BGA Reballing Stencil For Huawei Honor 50 50Pro For Qualcomm Snapdragon 778G SM7325 Tin Planting Soldering Net IC Chip
9%
$4.30
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7%
$2.61
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1%
$3.73
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1%
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1%
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1%
$16.76
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~
$22.90
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1%
$13.76
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1%
~
$24.30
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0.051, 5.07
6/.019,996 0=.000,178 1=.001,692/1 2=.001,476/1 3=.001,416/1 4=.006,151/1 5=.000,195/1 6=.009,066/36
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