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BGA Reballing Stencil Kit for HUAWEI Mate50 Pro/Mate50 RS Motherboard middle layer tin replanting Direct heating BGA Template
sku: 1005005107266303
$13.34
550.00 грн.
+2%
~
560.00 грн.
$13.34, $1.00 = 41.90 грн.
1,260.00 руб.
+4%
~
1,310.00 руб.
$13.34, $1.00 = 98.00 руб.
€ 12.40
+3%
~
€ 12.70
$13.34, € 1.00 = $1.05
Shipping from: China
the store does not ship to your country
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