BGA Reballing Stencil Kit for A11 A10 A9 A8 CPU Planting Solder Rework With Magnetic Positioning Platform

BGA Reballing Stencil Kit for A11 A10 A9 A8 CPU Planting Solder Rework With Magnetic Positioning Platform
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sku: 33010387761
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$15.18
Shipping from: China
   Technical Details
Application: For iPhone CPU A11 A10 A9 A8
Particle Size: 1-10μm
Type: CPU BGA Reballing Stencil Plant Tin Kit Set
   Price history chart & currency exchange rate

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