B-320 RFID Die Bonding Machine

B-320 RFID Die Bonding Machine
sku: 32555355691
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$9,900.00
Shipping from: China
   Technical Details
Control Method and Power Supply: PLC Control, 220VAC
Die Bonding Accuracy: +-20um
Die Dimension: 0.3mm x 0.3mm ~2.5mm x2.5mm,UF, UHF
Die Supply: Tray Plate
Heat Pressure Range: 0.55N~2N ±0.08N
Heat Pressure Temperature: 50~250C ±1C
is customized: Yes
Machine Dimension: L640mm*W460mm*H600mm
Machine Weight and Power: About35kg, 200W
Model Number: B-320
Product Dimension: Antenna <=120mm x 100mm
Type: Other
Vision System: Vision System:Two (Upper for antenna, Below for Die)
   Price history chart & currency exchange rate

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