Applicable to Mi 10 Snapdragon 865 SM8250 CPU cover 496 ball upgrade expansion temporary memory 12 16G new

Applicable to Mi 10 Snapdragon 865 SM8250 CPU cover 496 ball upgrade expansion temporary memory 12 16G disassembly plant test

Applicable to Mi 11 Snapdragon 888 SM8350 CPU cover 496 ball upgrade expansion temporary memory 12 16G disassembly plant test

Applicable to millet tablet 5 Pro Snapdragon 870 CPU cover 496 ball upgrade expansion temporary memory 12 16G disassembly plant

Applicable to millet tablet 5 Pro Snapdragon 870 CPU cover 496 ball upgrade expansion temporary memory 12 16G disassembly plant

For Xiaomi 11 Snapdragon 888 SM8350 CPU cover 496 ball upgrade expansion temporary memory 12 16G new

Applicable to Mi 8 Snapdragon 845 SDM845 CPU cover 556 ball upgrade expansion temporary memory 8G 10G new

Applicable to Mi 9 Snapdragon 855 SM8150 CPU cover 556 ball upgrade expansion temporary memory 8G 12G new

For Xiaomi Tablet 5 Pro Snapdragon 870 CPU cover 496 ball upgrade expansion temporary memory 12 16G new

Applicable to Mi 9 Snapdragon 855 SM8150 CPU cover 556 ball upgrade expansion temporary memory 8G 12G disassembly plant test

Applicable to Mi8 Snapdragon 845 SDM845 CPU cover 556 ball upgrade expansion Temporary memory 8G 10G disassembly plant test well

Snapdragon 865 CPU cover 496 balls LPDDR5 temporary memory K3LK5K5 K3LK4K4 D9XVM new

For Snapdragon 865 870 888 CPU cover 496 ball LPDDR5 operating memory D9ZMM H58GU6MK6H disassembly plant test

Applicable to millet tablet 4 generation magic expansion upgrade EMCP 64G 128G hard disk 4G 6G temporary memory new

Applicable to millet tablet 2 generation notebook Air 12.5 magic change expansion 4G 8G temporary memory 128G256G hard disk new

Applicable to Millet 15.6pro notebook Air 13.3 Lenovo X395 expansion upgrade DDR16G32G temporary memory new

For Dell XPS 13 9350 expansion upgrade LPDDR3 178 balls 16G cache temporary memory Brand new

For Snapdragon 888 CPU cover 496 balls LPDDR5 temporary memory K3LK6K6 H9JKNNNFB3AE disassembly plant test

Applicable to Millet 15.6pro notebook Air 13.3 Lenovo X395 expansion upgrade DDR16G32G temporary memory disassembly plant test

Applicable to millet tablet 1 generation magic change expansion upgrade LPDDR3 216 balls 3G temporary memory 64G 128G hard disk

Snapdragon 865 870 888 CPU cover 496 balls LPDDR5 RAM D9ZMM H58GU6MK6H new

Applicable to Huawei Honor light notebook MagicBook 14 2018 14-inch expansion 16G memory new

Applicable to Microsoft Surface Book1 1 laptop expansion LPDDR3 memory 178 balls 8G 16G Disassembly plant test

Suitable for Dell XPS 13 9350 expansion upgrade LPDDR3 178 balls 16G cache temporary memory disassembly plant test

For Microsoft laptop Surface Book2 2 Expansion LPDDR3 temporary memory 178 balls 8G 16G Disassembly plant test

Фонарь LPDDR5 K3LK6K60BMBGCP, 16 ГБ, фонарь 8 ГБ, Фонарь 12 Гб для Snapdragon 865, SM8250, ОЗУ LPDDR5

AMAOE SM8250 CPU Is Suitable for Snapdragon 865 U10 U11 Poco X3 Pro SDM8150 CPU BGA Electroplating Template Tin Plating Kit

AMAOE SM8250 CPU BGA Reballing 865 U10 U11 Poco X3 Pro SDM8150 Chip Planting Tin Platform Repair Tools Stencil For Snapdragon

AMAOE SM8250 CPU BGA Reballing Stencil For Snapdragon 865 U10 U11 Poco X3 Pro SDM8150 Chip Planting Tin Platform Repair Tools

Amaoe U-QSU5 BGA Reballing Stencil for Qualcomm Snapdragon CPU RAM 888/870/865/SM8450/8550/8475/8425/SM8250/8350

AMAOE SM8250 BGA Reballing Stencil Planting Tin Platform For Snapdragon 865 U10 U11 Poco X3 Pro SDM8150 IC Chip Repair Tools

10piece SM8S30A SM8S30 DO-218AB

LMDTK Новый L18C3PF2 Аккумулятор для ноутбука L340 L340-15API L18D3PF1 L18L3PF1

Zhiyun Smooth 4 Handheld CameraPhone HolderStabilizerBlack

1pc Silicone Pastry Bag, Blue

Here Comes the Moose Oil Painting on Canvas - 100% Hand Made

storage bottles & jars transparent sealed with buckle household kitchen snack practical and durable tools