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Amaoe U12 BGA Reballing Stencil Template Station Kits for SM7150 Snapdragon 730 Solder Tin Plant Net Heating Steel Mesh
sku: 1005005741043959
$6.95
+2%
$7.09
278.00 грн.
+6%
~
295.00 грн.
$7.09, $1.00 = 41.55 грн.
635.00 руб.
+25%
~
795.00 руб.
$7.09, $1.00 = 112.36 руб.
€ 6.40
+5%
~
€ 6.75
$7.09, € 1.00 = $1.05
Shipping from: China
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$6.90
Amaoe U12 BGA Reballing Stencil Template Station Kits for SM7150 Snapdragon 730 Solder Tin Plant Net Heating Steel Mesh
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Amaoe U12 BGA Reballing Stencil Template Station Kits for SM7150 Snapdragon 730 Solder Tin Plant Net Heating Steel Mesh
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SM7150 BGA Stencil For Snapdragon 730 CPU Chip Reball IC Pins Solder Tin Plant Net Heating Template Steel Mesh Amaoe Square Hole
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0.12MM Amaoe BGA Stencil Reballing SM7150 For Snapdragon 730 CPU Chip IC Pins Solder Tin Plant Net Heating Template Square Hole
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AMAOE U12 Planting Tin Platform Kit for Snapdragon 730 SM7150 CPU 0.12mm Steel Mesh Positioning Plate BGA Reballing Stencil Set
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CPU BGA Reballing Stencil Template Station For Snapdragon 730 680 SM7150 SM6225 Positioning Plate Plant tin net Steel mesh
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Amaoe QU7 BGA Reballing Stencil SM4250 6125 6115 7125 SM7150 7225 7250 7350 0.12mm IC CPU Chip Reballing Solder Tin Plant Net
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Amaoe BGA reballing stencil For REDMI K20 K20Pro XIAOMI 9 Qualcomm Snapdragon 730 sm7150 855 SM8150 CPU Chip BGA Tin Plant Net
16%
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Amaoe SAM7 For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA Stencil IC Solder Reballing Tin
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Amaoe QU7 BGA Reballing Stencil SM4250 6125 6115 7125 SM7150 7225 7250 7350 0.12mm IC CPU Chip Reballing Solder Tin Plant Net
1%
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1%
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1%
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1%
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-2%
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1%
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1%
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0.052, 2.09
7/.021,195 0=.000,101 1=.000,658/1 2=.000,784/1 3=.000,404/1 4=.000,472/1 5=.012,157/1 6=.000,103/1 7=.006,617/36
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