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Amaoe SAM7 BGA Reballing Stencil For Samsung S9 S9+ Exynos9810 Snapdragon 845 CPU Steel Mesh IC Tin Plant Net Repair Tools
sku: 1005005694015123
$7.06
276.00 грн.
+6%
~
293.00 грн.
$7.06, $1.00 = 41.45 грн.
640.00 руб.
-3%
~
620.00 руб.
$7.06, $1.00 = 88.11 руб.
€ 6.55
-1%
~
€ 6.50
$7.06, € 1.00 = $1.09
Shipping from: China
the store does not ship to your country
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$7.11
Amaoe SAM7 BGA Reballing Stencil For Samsung S9 S9+ Exynos9810 Snapdragon 845 CPU Steel Mesh IC Tin Plant Net Repair Tools
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Amaoe SAM7 For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA Stencil IC Solder Reballing Tin
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Amaoe SAM7 For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA Stencil IC Solder Reballing Tin
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Amaoe SAM7 For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA Stencil IC Solder Reballing Tin
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Amaoe SAM7 BGA Reballing Stencil For Samsung S9 Plus S9+ For Snapdragon 845 CPU IC For Exynos9810 Tin Planting Soldering Net
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Amaoe SAM7 BGA Reballing Stencil For Samsung S9 S9+ S9Plus Exynos9810 For Snapdragon 845 CPU Tin Planting Soldering Net IC Chip
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Amaoe BGA reballing stencil For SAMSUNG S9 S9+ Snapdragon 845 Exynos9810 CPU RAM WIFI POWER Chip Tin Plant Net
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$4.75
Amaoe BGA reballing stencil For SAMSUNG S9 S9+ Snapdragon 845 Exynos9810 CPU RAM WIFI POWER Chip Tin Plant Net
41%
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Amaoe SAM7 BGA Reballing Stencil For Samsung S9 S9+ Exynos9810 For Snapdragon 845 CPU Baseband eMMC Wifi Touch Power PA AUDIO IC
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Amaoe BGA Reballing Stencil SAM7 For Samsung S9 S9+ Exynos9810 Snapdragon SDM845 CPU Steel Mesh
36%
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Amaoe SAM7 For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA Stencil IC Solder Reballing Tin
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Amaoe BS2 BGA Reballing Stencil for Snapdragon 855 845 SM845 SM8150 Black Shark 1 2 2Pro Helo 0.12MM Tin Plant Net
34%
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27%
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Amaoe SAM7 BGA Reballing Stencil For Samsung S9 S9+ Exynos9810 For Snapdragon 845 CPU Baseband eMMC Wifi Touch Power PA IC
26%
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Amaoe SAM7 BGA Reballing Stencil For Samsung S9 S9+ Exynos9810 For Snapdragon 845 CPU Baseband eMMC Wifi Touch Power PA IC
23%
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Amaoe SAM7 BGA Reballing Stencil For SAMSUNG S9 S9Plus S9+ Qualcomm SDM845 Exynos9810 CPU RAM EMMC Audio Wifi IC Chip Steel Mesh
+1%
21%
$4.07
Amaoe BGA Reballing Stencil For Samsung S9 S9+ CPU Exynos 9810 SDM845 Snapdragon 845 Re-balling Tin Net
18%
$14.50
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16%
$5.38
Amaoe BGA Reballing Stencil For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA IC Solder Tin
9%
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0.12mm Amaoe Mi 9 BGA Reballing Stencil for Xiaomi 8 8se MIX 2s Snapdragon SDM 845 710 CPU RAM POWER WIFI IC Chip Steel Mesh
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5%
$2.80
Mechanic Universal BGA Reballing Stencil for Samsung s9/s9+ Qualcomm Snapdragon 845/Exynos9810 CPU Power WIFI Audio IC Chip Mesh
3%
$2.69
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$4.75
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+6%
1%
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Amaoe BS2 BGA Reballing Stencil for Snapdragon 855 845 SM845 SM8150 Black Shark 1 2 2Pro Helo 0.12MM Tin Plant Net
-2%
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1%
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1%
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0.036, 8.79
7/.014,558 0=.000,078 1=.000,833/1 2=.000,822/1 3=.000,548/1 4=.000,870/1 5=.004,897/1 6=.000,106/1 7=.006,482/36
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