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Amaoe QU1-8 BGA Reballing Stencil For MSM8996 8976 8992 8953 8998 8909 8928 8952 8940 8974 8994 8960 SM8250 8350 7350 7250 CPU
артикул: 1005004763340011
$2.88
119.00 грн.
+1%
~
121.00 грн.
$2.88, $1.00 = 41.90 грн.
281.00 руб.
+1%
~
283.00 руб.
$2.88, $1.00 = 98.37 руб.
€ 2.68
+3%
~
€ 2.78
$2.88, € 1.00 = $1.04
Доставка из: Китай
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100%
$3.00
Amaoe QU1-8 BGA Reballing Stencil For MSM8996 8976 8992 8953 8998 8909 8928 8952 8940 8974 8994 8960 SM8250 8350 7350 7250 CPU
97%
$2.91
Amaoe QU1-8 BGA Reballing Stencil For MSM8996 8976 8992 8953 8998 8909 8928 8952 8940 8974 8994 8960 SM8250 8350 7350 7250 CPU
94%
$2.85
Amaoe QU1-8 BGA Reballing Stencil For MSM8996 8976 8992 8953 8998 8909 8928 8952 8940 8974 8994 8960 SM8250 8350 7350 7250 CPU
57%
$2.80
Mechanic BGA Reballing Stencil for SDM845/710/660/670/SM8150/SM6150/MSM8996/8992/8909/8928/8952/8940/8998/8953/8937/8976 CPU IC
55%
$2.80
Mechanic BGA Reballing Stencil for SDM845/710/660/670/SM8150/SM6150/MSM8996/8992/8909/8928/8952/8940/8998/8953/8937/8976 CPU IC
39%
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Amaoe QU3 BGA Reballing Stencil For Qualcomm MSM MSM7225 8928 8940 SDM660 8909 8952 8612 CPU IC Chip Tin Plant Net Steel Mesh
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Amaoe QU3 BGA Reballing Stencil For Qualcomm MSM MSM7225 8928 8940 SDM660 8909 8952 8612 CPU IC Chip Tin Plant Net Steel Mesh
32%
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Amaoe QU3 BGA Reballing Stencil For Qualcomm MSM MSM7225 8928 8940 SDM660 8909 8952 8612 CPU IC Chip Tin Plant Net Steel Mesh
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30%
$4.27
Amaoe QU3 BGA Reballing Stencil For Qualcomm MSM MSM7225 8928 8940 SDM660 8909 8952 8612 CPU IC Chip Tin Plant Net Steel Mesh
24%
$3.29
Amaoe RAM2 RAM1 BGA Reballing Stencil for BGA216 168 256 136 366 556 272 MSM 8992 8956 8974 8928 CPU Upper Layer RAM Steel Mesh
23%
$4.98
Amaoe RAM2 BGA Reballing Stencil for BGA216 168 256 136 MSM 8992 8956 8974 8928 8909W MT6797 CPU Upper Layer RAM Steel Mesh
22%
$3.16
Amaoe RAM2 RAM1 BGA Reballing Stencil for BGA216 168 256 136 366 556 272 MSM 8992 8956 8974 8928 CPU Upper Layer RAM Steel Mesh
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16%
$3.00
Amaoe BGA Reballing Stencil For MSM8996/8992/8956/8998 HI3650/6260/3670/3680/7885 BGA365/366/556/256/272/320/168/136 RAM IC Chip
14%
$2.69
Wylie WL-58 BGA Reballing Stencil For PM660 8937 8994 8952 8940 8998 8084 8226 8821 8028 8029 PM Power Chip IC Tin Steel Mesh
12%
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Wylie WL-58 BGA Reballing Stencil For PM660 8937 8994 8952 8940 8998 8084 8226 8821 8028 8029 PM Power Chip IC Tin Steel Mesh
9%
$2.86
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4%
$2.42
0.12MM Amaoe QU1 BGA Reballing Stencil CPU Universal For Qualcomm MSM Series Reballing MSM8996 8976 8992 8953 MSM8994 SDM660
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1%
$2.32
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-10%
1%
$2.02
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1%
$2.90
0.12MM Amaoe QU1 BGA Reballing Stencil CPU Universal For Qualcomm MSM Series Reballing MSM8996 8976 8992 8953 MSM8994 SDM660
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$2.28
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1%
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Amaoe Universal QU1 BGA Reballing Stencil CPU For Qualcomm MSM Series Reballing MSM8996 8976 8992 8953 MSM8994 SDM660 0.12MM
1%
$6.15
Amaoe For Qualcomm CPU Universal Reballing Stencil for Qualcomm MSM Series Reballing QU1 QU2 QU3 QU4 MSM8996 8976 8992 8953
1%
$4.99
Amaoe QU1 CPU Universal Reballing Stencil for Qualcomm MSM Series Reballing MSM8996 8976 8992 8953 MSM8994 SDM660
1%
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Amaoe QU3 BGA Reballing Stencil for Qualcomm MSM7225 8928 8940 8909 8952 8612 SDM660 0.12mm Direct Heating Template Steel Mesh
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PM power IC BGA Stencil PM8956 8998 8953 8038 PMI8996 8998 8952 8994 PMC8084 8974 Reballing IC Pin Solder Direct Heat Template
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Amaoe QU3 BGA Reballing Stencil for Qualcomm MSM7225 8928 8940 8909 8952 8612 SDM660 0.12mm Direct Heating Template Steel Mesh
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PM power IC BGA Stencil PM8956 8998 8953 8038 PMI8996 8998 8952 8994 PMC8084 8974 Reballing IC Pin Direct Heating Template G1062
1%
$7.06
Amaoe U3 BGA Reballing Stencil for MSM8916 8939 8937 8940 8953 8952 CPU Tin Plant Net Solder Steel Mesh Template
-6%
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О нас
Контакты
0.037, 2.51
7/.014,976 0=.000,087 1=.000,874/1 2=.000,786/1 3=.000,403/1 4=.001,368/1 5=.004,964/1 6=.000,114/1 7=.006,467/36
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