Amaoe Middle layer BGA Reballing Stencil for Iphone X CPU IC Chip Tin Planting Soldering Net 0.15mm thickness

Amaoe Middle layer BGA Reballing Stencil for Iphone X CPU IC Chip Tin Planting Soldering Net 0.15mm thickness
артикул: 1005003742087175
СОГЛАСНО НАШИМ ДАННЫМ, ЭТОТ ПРОДУКТ СЕЙЧАС НЕ ДОСТУПЕН
$4.96
Доставка из: Китай
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Amaoe High Quality Middle layer BGA Reballing Stencil for Iphone X CPU IC Chip Tin Planting Soldering Net 0.15mm thickness
100%
$4.96
Amaoe High Quality Middle layer BGA Reballing Stencil for Iphone X CPU IC Chip Tin Planting Soldering Net 0.15mm thickness
Amaoe High Quality Middle layer BGA Reballing Stencil for Iphone X CPU IC Chip Tin Planting Soldering Net 0.15mm thickness
99%
$3.89
Amaoe High Quality Middle layer BGA Reballing Stencil for Iphone X CPU IC Chip Tin Planting Soldering Net 0.15mm thickness
Amaoe Middle layer BGA Reballing Stencil for Iphone X CPU IC Chip Tin Planting Soldering Net 0.15mm thickness
97%
$3.89
Amaoe Middle layer BGA Reballing Stencil for Iphone X CPU IC Chip Tin Planting Soldering Net 0.15mm thickness
Amaoe High Quality Middle layer BGA Reballing Stencil for Iphone X CPU IC Chip Tin Planting Soldering Net 0.15mm thickness
94%
$4.96
Amaoe High Quality Middle layer BGA Reballing Stencil for Iphone X CPU IC Chip Tin Planting Soldering Net 0.15mm thickness
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92%
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Amaoe Middle layer BGA Reballing Stencil for Iphone X CPU IC Chip Tin Planting Soldering Net 0.15mm thickness
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Amaoe Middle layer BGA Reballing Stencil for Iphone 6S hard disk CPU IC Chip Tin Planting Soldering Net 0.15mm thickness
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82%
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