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Amaoe Middle Layer BGA Reballing Stencil for SAMSUNG S21 Ultra SM-G998U/W/0/D CPU IC Chip Tin Planting Soldering Net
sku: 1005006523132522
$2.24
+1%
$2.26
93.00 грн.
+1%
~
94.00 грн.
$2.26, $1.00 = 41.55 грн.
210.00 руб.
+14%
~
239.00 руб.
$2.26, $1.00 = 105.91 руб.
€ 2.06
+4%
~
€ 2.14
$2.26, € 1.00 = $1.06
Shipping from: China
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Amaoe Middle Layer BGA Reballing Stencil for SAMSUNG S21 Ultra SM-G998U/W/0/D CPU IC Chip Tin Planting Soldering Net
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AMAOE BGA Reballing Stencil for Samsung S21 Ultra SM-G998U/W/0/D Middle-level Tin Planting Mesh Steel Chip Solder Template Net
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AMAOE Tin Planting Platform Set for SAMSUNG S21 Ultra SM-G998U/W/0/D Middle Layer 0.12mm BGA Reballing Stencil Kits
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AMAOE S21 BGA Reballing Stencil Platform for Ultra SM-G998U Middle Layer Motherboard PCB Position Goard/Tin Planting Template
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AMAOE Magnetic Planting Tin Platform for S21 S21+ S21 Ultra SM-G991U/G996U/G998U 0.12mm BGA Reballing Stencil with Fixture
31%
$3.70
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-26%
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$4.28
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14%
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$2.30
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3%
$3.20
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1%
$3.49
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1%
$4.69
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1%
$2.50
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1%
$5.19
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1%
$1.96
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1%
$3.20
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1%
$2.50
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1%
$4.50
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1%
$4.40
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1%
$3.46
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1%
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1%
$49.60
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1%
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