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Amaoe Mi6 BGA Reballing Stencil For Redmi Note 5 5pro Xiaomi Note3 6X SDM660/SDM636 CPU RAM POWER WIFI AUDIO IC Chip Steel Mesh
sku: 1005006285105674
$2.16
+5%
$2.27
86.50 грн.
+9%
~
94.50 грн.
$2.27, $1.00 = 41.55 грн.
198.00 руб.
+29%
~
255.00 руб.
$2.27, $1.00 = 112.36 руб.
€ 1.99
+8%
~
€ 2.16
$2.27, € 1.00 = $1.05
Shipping from: China
the store does not ship to your country
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Amaoe MI6 BGA Reballing Stencil For Redmi Note 5 5Pro Xiaomi Note3 6X CPU SDM660 SDM636 RAM POWER WIFI AUDIO IC Chip Steel Mesh
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Amaoe Mi6 BGA Reballing Stencil For Redmi Note 5 5pro Xiaomi Note3 6X SDM660/SDM636 CPU RAM POWER WIFI AUDIO IC Chip Steel Mesh
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Amaoe MI6 BGA Reballing Stencil For Redmi Note 5 5Pro Xiaomi Note3 6X CPU SDM660 SDM636 RAM POWER WIFI AUDIO IC Chip Steel Mesh
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Трафарет Amaoe MI6 BGA для реболлинга для Redmi Note 5 5Pro Xiaomi Note3 6X CPU SDM660 SDM636 RAM POWER WIFI Аудио IC чип стальная сетка
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$4.75
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Amaoe MI6 BGA Reballing Stencil for Qualcomm Snapdragon 636 660 CPU Redmi Note 5 5Pro Xiaomi Note 3 6X Phone Repair
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0.132, 3.4
6/.052,636 0=.000,078 1=.001,263/1 2=.005,985/1 3=.001,065/1 4=.015,218/1 5=.001,065/1 6=.028,040/36
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