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Amaoe Mi2 CPU BGA Reballing Stencil Template For XiaoMi4 Mi3 3S Note MSM8274 MSM8674 MSM8974 Tin Planting Soldering Net Chip IC
sku: 1005004236128431
$3.98
162.00 грн.
+2%
~
165.00 грн.
$3.98, $1.00 = 41.40 грн.
365.00 руб.
+13%
~
413.00 руб.
$3.98, $1.00 = 103.70 руб.
€ 3.68
+3%
~
€ 3.80
$3.98, € 1.00 = $1.05
Shipping from: China
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$3.98
Amaoe Mi2 BGA Reballing Stencil Template For XiaoMi4 Mi3 3S Note MSM8974 MSM8274 MSM8674 CPU Tin Planting Soldering Net IC Chip
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Mechanic Universal BGA Reballing Stencil for XIaomi 4 Series Mi3 3S Note MSM8274 MSM8674 MSM8974 CPU Power Audio IC Chip Tin Net
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Трафарет Amaoe Mi2 BGA для реболлинга, шаблон для ЦП XiaoMi4, Mi3, 3S, Note MSM8974, MSM8274, MSM8674, Оловянная паяльная сеть, чип IC
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Amaoe 0.12mm MI2 For XIAOMI 4/3/3S/NOTE MSM8974/MSM8274/8674 CPU RAM WIFI AUDIO POWER Chip BGA Stencil IC Solder Reballing Tin
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Amaoe MI2 BGA Reballing Stencil For Xiaomi 4 Series 3 3S NOTE MSM8974 8274 8674 CPU POWER WIFI AUDIO IC Chip Tin Planting Solder
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Amaoe MI2 BGA Reballing Stencil For Xiaomi 4 Series 3 3S NOTE MSM8974 8274 8674 CPU POWER WIFI AUDIO IC Chip Tin Planting Solder
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0.043, 1.83
6/.013,253 0=.000,168 1=.001,078/1 2=.000,876/1 3=.000,696/1 4=.005,035/1 5=.000,096/1 6=.005,472/36
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