Amaoe Mbga-B8 BGA Reballing Platform for Android CPU SM7250 SM7350 SM6150 MSM8952 MSM8909 MT6761 MT6762 MT6765 Remove Glue Kit

Amaoe Mbga-B8 BGA Reballing Platform for Android CPU SM7250 SM7350 SM6150 MSM8952 MSM8909 MT6761 MT6762 MT6765 Remove Glue Kit
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sku: 1005004310099104
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$4.40
Shipping from: China
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Amaoe Mbga-B8 CPU BGA Reballing Platform For Android SM7250 SM7350 SM6150 MT6761 MT6762 MT6765 MSM8952 MSM8909 Remove Glue Kit
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Amaoe Mbga-B8 BGA Reballing Platform for Android CPU SM7250 SM7350 SM6150 MSM8952 MSM8909 MT6761 MT6762 MT6765 Glue Removing
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15%
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Реболлирующая платформа Amaoe для Android CPU SM7250 SM7350 SM6150 MSM8952 MSM8909 MT6761 MT6762 MT6765, удаление клея в комплекте
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