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Amaoe MI13 BGA Reballing Stencil for Redmi Note9Pro Series Qualcomm Snapdragon 750G SM7225 CPU Steel Mesh Phone Repair
sku: 1005003712537951
$4.50
185.00 грн.
+1%
~
187.00 грн.
$4.50, $1.00 = 41.55 грн.
426.00 руб.
-7%
~
396.00 руб.
$4.50, $1.00 = 88.01 руб.
€ 4.20
+2%
~
€ 4.30
$4.50, € 1.00 = $1.05
Shipping from: China
the store does not ship to your country
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81%
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Amaoe MI13 BGA Reballing Stencil For Redmi Note9Pro Series Qualcomm Snapdragon 750G SM7225 CPU Steel Mesh
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Amaoe Mi13 BGA Reballing Stencil For Xiaomi Redmi Note 9 Pro Snapdragon 750G SM7225 CPU RAM POWER WIFI AUDIO IC Chip Steel Mesh
43%
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40%
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23%
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17%
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For Redmi Note9Pro BGA Stencil 750G SM7225 CPU IC Bottom Layer Chip Reballing Solder Tin Plant Net Amaoe MI13
13%
$4.51
Amaoe BGA reballing stencil For REDMI K20 K20Pro XIAOMI 9 Qualcomm Snapdragon 730 sm7150 855 SM8150 CPU Chip BGA Tin Plant Net
7%
$6.50
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5%
$2.21
Amaoe QU8 BGA Reballing Stencil For SM8350 SDM439 SM8250 102/002 For Qualcomm Snapdragon 888 CPU RAM BGA Direct Heat Template
3%
$6.50
Amaoe-Steel Mesh Fixture Stencil for Qualcomm Snapdragon SM7150 6225 730G IC Chip BGA Reballing Stencil, Mobile Phone CPU Solder
2%
$2.33
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1%
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Amaoe U-QSU BGA Reballing Solder Template Stencil for Qualcomm Snapdragon CPU SM8450/SM8350/SM6225/SM8150/SDM636 RAM496 RAM556
1%
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-1%
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Amaoe U-QSU4 BGA Reballing Solder Template Stencil for Qualcomm Snapdragon CPU SM7315/SM6125/SM7450/SM6225/SM7350/SM4250/SM6115
-6%
1%
$2.26
AMAOE BGA Reballing Stencil for SM7550 Qualcomm Snapdragon 7Gen3 CPU Precision square hole BGA template Tin planting platform
-3%
1%
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-1%
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Amaoe U-QSU5 BGA Reballing Solder Template Stencil for Qualcomm Snapdragon CPU SM8550/SM8450/SM8350/SM8250/SM8475 RAM496 RAM556
1%
$4.30
AMAOE U-QSD11 BGA Reballing Stencil for Qualcomm Snapdragon 6Gen1/8Gen2/8Gen3/SM6450/SM8550/SM8650 Precision BGA template
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