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Amaoe BGA Stencil Mbga-12 ProMax For iPhone 12 Promax Middle Layer Board Reball Solder Tin Plant Net Steel Mesh Heat Template
sku: 1005002093759947
$2.42
93.50 грн.
+5%
~
98.50 грн.
$2.42, $1.00 = 40.60 грн.
222.00 руб.
-4%
~
213.00 руб.
$2.42, $1.00 = 87.98 руб.
~
€ 2.24
$2.42, € 1.00 = $1.08
Shipping from: China
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$3.68
Amaoe BGA Stencil Mbga-12 ProMax For iPhone 12 Promax Middle Layer Board Reball Solder Tin Plant Net Steel Mesh Heat Template
84%
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For iPhone 12 12Pro Middle Layer Board MBGA BGA Stencil Reball Solder Tin Plant Net Steel Mesh Heat Template Amaoe Square Hole
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Amaoe BGA Stencil Mbga-IP12 Middle Net For iPhone12/Pro/Max/mini Layer Board Reball Solder Tin Plant Steel Mesh Heat Template
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For iPhone 12Mini Middle Layer Board MBGA BGA Stencil Reball Solder Tin Plant Net Steel Mesh Heat Template Amaoe Square Hole
74%
$7.25
For iPhone 12Promax Middle Layer Board MBGA BGA Stencil Reball Solder Tin Plant Net Steel Mesh Heat Template Amaoe Square Hole
+5%
60%
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Amaoe For Samsung SM-F700F SM-F700U Middler Layer BGA Stencil Reball Solder Board Tin Plant Net Rework Heat Steel Mesh Template
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A13 A14 CPU BGA Stencil For iPhone 11 Pro Max 12 Promax 12mini Bottom Layer IC Reball Solder Tin Plant Net Steel Mesh Amaoe AU4
54%
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A13 A14 CPU BGA Stencil For iPhone 11 Pro Max 12 Promax 12mini Bottom Layer IC Reball Solder Tin Plant Net Steel Mesh Amaoe AU4
51%
$7.25
A13 A14 CPU BGA Stencil For iPhone 11 Pro Max 12 Promax 12mini Bottom Layer IC Reball Solder Tin Plant Net Steel Mesh Amaoe AU4
45%
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AMAOE BGA Stencil Reball Solder Tin Plant Net Mesh For Samsung ZFold3 LCD Display Board SM-F926 SM-W2022 Weld Steel Mesh Rework
44%
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Amaoe Q888 BGA Stencil For Snapdragon 888 CPU RAM Top Bottom Layer IC Chip Reball IC Pin Solder Heat Tin Plant Net Steel Stencil
37%
$4.50
Amaoe AU310 A11 A12 CPU BGA Stencil For iPhone 7 Plus 8 8P X XS MAX XR Bottom Layer IC Reball Solder Tin Plant Net Steel Mesh
34%
$4.50
Amaoe HW14 BGA Reballing Stencil CPU IC for Huawei 20Plus 20Pro Nova8se X10Max Chip Reball Solder Tin Plant Net Steel Mesh Tool
31%
$3.34
Amaoe A9 A10X BGA Reball Stencil Template For Pad Pro 2017 CPU RAM Nand Power Audio IC Solder Tin Plant Heat Steel Mesh
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18%
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Amaoe BGA Reballing Stencil HW14 CPU IC For Huawei 20Plus 20Pro Nova8se X10Max Chip Reball Solder Tin Plant Net Steel Mesh
15%
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Amaoe MBGA-MB2 For iPhone 11 Pro Max Swap Board BGA Stencil A13 CPU Baseband Nand Flash Wifi IC Reballing Solder Tin Plant Net
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10%
$2.85
0.20MM Amaoe BGA Stencil T920L TU30 For LCD TV CPU Chipset Reball IC Pin Square Hole Solder Tin Plant Net Heating Template
4%
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Amaoe MBGA-U4 A11 A12 A13 CPU IC BGA Stencil For iPhone 8 8Plus X XS Max XR 11 ProMax Bottom Layer Chip Reballing Solder
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Amaoe MAC:7 For MacBook Pro A2159/A1989/A1990 BGA Stencil 339S00616/338S00466-A0 BGA 110/178 T2 CPU RAM Chip Solder Reball
1%
$5.90
Amaoe Mbga-B14 Phone CPU BGA Balls Reball Stencil Kit Glue Removal Exynos 9820/9815/9611/9609/9610/8895/8890/7904/7884/7885
1%
$5.90
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1%
$5.90
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1%
$5.90
Amaoe Mbga-B8 Phone CPU BGA Balls Reball Stencil Kit Glue Removal SM7250/7350/6150 MSM8952/8909 MT6761/6762/6765 Repair Tools
1%
$5.90
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1%
$5.90
Amaoe Mbga-B7 Phone CPU BGA Balls Reball Stencil Kit Glue Removal MT6785V/6735V/3737/3753/6779V/6732/6752/6757V/6873V/6758V/6853
1%
$5.90
Amaoe Mbga-B5 Phone CPU BGA Balls Reball Stencil Kit Glue Removal SM4250/6115/6125/8150/7225/8250 SDM845/439/660/450/632 MSM8916
1%
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Amaoe Mbga-B10 Phone CPU BGA Balls Reball Stencil Kit Glue Removal Hi6260/3630/3635/6280/6250/9500 For Huawei HiSilicon Android
1%
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Amaoe Mbga-B9 Phone CPU BGA Balls Reball Stencil Kit Glue Removal Hi3680/3660/3670/3690/3650/6290/6290L/36A0 RAM366/376/436
1%
$5.90
Amaoe Mbga-B14 Phone CPU BGA Balls Reball Stencil Kit Glue Removal Exynos 9820/9815/9611/9609/9610/8895/8890/7904/7884/7885
1%
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20X деревянная мини-Скалка, 6 дюймов, длинная кухонная скалка для выпечки, маленький деревянный ролик для теста для детей, Макарон для помадки
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7/.014,890 0=.000,081 1=.001,019/1 2=.002,909/1 3=.000,521/1 4=.000,508/1 5=.004,763/1 6=.000,167/1 7=.005,003/36
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