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Amaoe BGA Reballing Stencil HW Hi HU For Huawei Mobile Phone Series Steel Mesh Repair Tools
sku: 1005005449942591
$9.30
364.00 грн.
+5%
~
383.00 грн.
$9.30, $1.00 = 41.15 грн.
850.00 руб.
+5%
~
890.00 руб.
$9.30, $1.00 = 95.86 руб.
€ 8.60
-1%
~
€ 8.50
$9.30, € 1.00 = $1.09
Shipping from: China
the store does not ship to your country
Price history chart & currency exchange rate
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44%
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Amaoe HW:16 BGA Reballing Stencil For Steel Mesh Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU SDR735
41%
$4.30
Amaoe HW:16 BGA Reballing Stencil For Huawei Honor 50/50Pro/Qualcomm Snapdragon 778G/SM7325 CPU SDR735 Steel Mesh
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$4.41
Amaoe HW 16 BGA Reballing Stencil For Huawei Glory 50/50pro Qualcomm Snapdragon 778G/SM7325 Tin Planting Net Steel Mesh
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21%
$4.40
Amaoe HW 9 Tin Planting Net Kirin710 Hi6260 CPU RAM For HUAWEI Honor 8X/20i/10/20 Lite/Nova 5i/4e/3i EMMC BGA Reballing Stencil
17%
$2.85
Amaoe HW:18 BGA Reballing Stencil For Huawei Mate 60 Pro RS X5 MSC06A SC8565 BGA153 Hi36A0 9000S S111341A Power CPU RAM Tin Net
16%
$4.40
Amaoe HW 9 Tin Planting Net Kirin710 Hi6260 CPU RAM For HUAWEI Honor 8X/20i/10/20 Lite/Nova 5i/4e/3i EMMC BGA Reballing Stencil
-1%
15%
$2.90
00.12mm AMAOE HW:18 BGA Reballing Solder Template Stencil for Huawei Mate60Pro+/60RS/X5/Hi36A0/9000S/CPU/HW18
+1%
9%
$4.80
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6%
$4.48
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4%
$3.61
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For Huawei CPU RAM IC BGA Stencil HI6260/3670/3680 Reballing Chip Tin Plant Net Solder Heat Template Amaoe 0.12mm Thickness HU:3
1%
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For Huawei CPU RAM IC BGA Stencil HI6260/3670/3680 Reballing Chip Tin Plant Net Solder Heat Template Amaoe 0.12mm Thickness HU:3
1%
$7.50
For Huawei CPU RAM IC BGA Stencil HI6260/3670/3680 Reballing Chip Tin Plant Net Solder Heat Template Amaoe 0.12mm Thickness HU:3
1%
$3.30
For Huawei CPU RAM IC BGA Stencil HI6260/3670/3680 Reballing Chip Tin Plant Net Solder Heat Template Amaoe 0.12mm Thickness HU:3
1%
$14.37
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+3%
1%
$13.74
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