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Amao HU1 is suitable for Huawei HI3650 HI3660 HI3630 CPU/RAM chip BGA mold IC solder soldering tin heating 0.12MM
sku: 1005001518282009
$4.07
167.00 грн.
+1%
~
169.00 грн.
$4.07, $1.00 = 41.45 грн.
384.00 руб.
-8%
~
353.00 руб.
$4.07, $1.00 = 86.83 руб.
€ 3.80
+2%
~
€ 3.88
$4.07, € 1.00 = $1.05
Shipping from: China
the store does not ship to your country
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Amaoe HU1 BGA Reballing Stencil For HI3650 HI3660 HI3630 Huawei P9/P8/P10/P10P/ Mate 8/9 Honor 8 Hi CPU RAM IC Chip Steel Mesh
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Amaoe HU1 BGA Reballing Stencil For HI3650 HI3660 HI3630 Huawei P9/P8/P10/P10P/ Mate 8/9 Honor 8 Hi CPU RAM IC Chip Steel Mesh
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5%
$4.64
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4%
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+1%
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Трафарет HU:1 BGA HI3630 HI3660 HI3650, верхний и нижний слои, шаблон прямого нагрева ЦПУ, толщина 0,12 мм, защита от барабана, 1 шт.
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1%
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Книга Artbooks. Велика книга динозаврів - Алекс Фріс
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