AMAOE X-12 middle layer BGA reballing stencil Mbga-B1 Planting tin positioning platform for iphone cpu ic chip tin planting
![AMAOE X-12 middle layer BGA reballing stencil Mbga-B1 Planting tin positioning platform for iphone cpu ic chip tin planting](http://ae04.alicdn.com/kf/Ha50a5b184af443219aae3d35085ac553D.jpg)
sku: 1005003795045437
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$52.00
Shipping from: China
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