AMAOE X-12 middle layer BGA reballing stencil Mbga-B1 Planting tin positioning platform for iphone cpu ic chip tin planting

AMAOE X-12 middle layer BGA reballing stencil Mbga-B1 Planting tin positioning platform for iphone cpu ic chip tin planting
sku: 1005003795045437
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$52.00
Shipping from: China
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