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AMAOE U-SM7325 BGA Reballing Stencil for Snapdragon 778G SM7315 Direct Heating Steel Mesh Positioning Plate for Phone Reapir
sku: 1005006002374855
$7.04
277.00 грн.
+3%
~
286.00 грн.
$7.04, $1.00 = 40.60 грн.
645.00 руб.
-4%
~
620.00 руб.
$7.04, $1.00 = 87.98 руб.
~
€ 6.55
$7.04, € 1.00 = $1.08
Shipping from: China
the store does not ship to your country
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AMAOE U-SM7325 BGA Reballing Stencil Kit for Snapdragon 778G SM7315 Direct Heating Tin Planting Platform for Phone Repair
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Amaoe BGA Reballing Stencil HW16 For Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 Steel Mesh phone repair tools
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Amaoe HW16 BGA Reballing Stencil for Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU IC Chip Tin Planting Tool 0.12MM
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Amaoe BGA Reballing Stencil HW16 For Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 Steel Mesh Phone RepairTools
37%
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Amaoe HW16 BGA Reballing Stencil for Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU IC Chip Tin Planting Tool 0.12MM
35%
$7.80
Amaoe HW16 BGA Reballing Stencil For Huawei Honor 50Pro Qualcomm Snapdragon 778G SM7325 MT6877V CPU Planting Tin Net Repair Tool
+1%
29%
$3.73
AMAOE HW16 BGA Reballing Stencil For HUAWEI Honor 50/50Pro Qualcomm Snapdragon 778G/SM7325/BGA254/BGA297 Direct heating template
28%
$4.50
Amaoe HW16 BGA Reballing Stencil for Huawei Glory 50/50pro Qualcomm Snapdragon 778G/SM7325 Tin Planting Net Steel Mesh
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$2.61
AMAOE BGA Reballing Stencil HW16 Tin Planting Mesh For HUAWEI Honor 50/50Pro/Qualcomm Snapdragon 778G/SM7325/Steel Mesh 0.12mm
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24%
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21%
$4.50
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20%
$4.41
Amaoe HW:16 BGA Reballing Stencil For Huawei Honor 50/50Pro/Qualcomm Snapdragon 778G/SM7325 CPU SDR735 Steel Mesh
19%
$4.50
Amaoe HW16 BGA Reballing Stencil for Huawei Glory 50/50pro Qualcomm Snapdragon 778G/SM7325 Tin Planting Net Steel Mesh
18%
$4.30
Amaoe HW:16 BGA Reballing Stencil For Huawei Honor 50/50Pro/Qualcomm Snapdragon 778G/SM7325 CPU SDR735 Steel Mesh
17%
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Amaoe HW 16 BGA Reballing Stencil For Huawei Glory 50/50pro Qualcomm Snapdragon 778G/SM7325 Tin Planting Net Steel Mesh
-1%
15%
$4.59
Amaoe HW16 BGA Reballing Stencil For Huawei Honor 50 50Pro Pro BGA297 Snapdragon 778G SM7325 CPU Power NAND IC Chip Steel Mesh
13%
$12.28
AMAOE U-SM7325 Magnetic Positioning Planting Tin Platform for Snapdragon 778G/SM7315 CPU Reballing Repair Stencil
10%
$4.99
Amaoe HW:16 BGA Reballing Stencil For Steel Mesh Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU SDR735
9%
$4.40
Amaoe HW 16 BGA Reballing Stencil For Huawei Glory 50/50pro Qualcomm Snapdragon 778G/SM7325 Tin Planting Net Steel Mesh
1%
$2.60
Amaoe HW16 BGA Reballing Stencil For Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU Planting Tin Net Repair Tools
1%
$3.76
Amaoe HW16 BGA Reballing Stencil For Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU Planting Tin Net Repair Tools
1%
$2.74
Amaoe HW16 BGA Reballing Stencil For Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU Planting Tin Net Repair Tools
1%
$3.73
BGA Reballing Stencil for SM8350/SM8450/SM7315/SM7325/MT6833V/MT6877V/MT6799W/Snapdragon 888/8Gen1/778G
+8%
1%
$4.98
Amaoe HW16 BGA Reballing Stencil for Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU IC Chip Tin Planting Tool 0.12MM
1%
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BGA Reballing Stencil for Qualcomm Snapdragon 7Gen1/680/775G/778G SM7450 SM6225 SM7350 SM7315 SM7325 Square hole BGA Template
1%
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$2.71
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7/.012,073 0=.000,072 1=.000,743/1 2=.000,730/1 3=.000,627/1 4=.000,937/1 5=.004,284/1 6=.000,134/1 7=.004,618/36
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